Electronics Manufacturing Engineer

About The Role

Position Summary At Acron, our ambition is to relentlessly reimagine and reshape the value chains through which we deliver results to our customers, suppliers, and stakeholder communities-all in pursuit of innovations that create safer skies. Across the Avionics Business Unit, our employees strive to achieve world‑class results by putting customers first, displaying ownership of outcomes, moving fast, and speaking candidly. To support this ambition, we are seeking an Electronics Manufacturing Engineer – Displays as part of the Acron Avionics Business Unit, based on-site in Grand Rapids, MI.

This role is focused on driving Zero Defects in the middle of the manufacturing process, where design intent meets production reality. The Electronics Manufacturing Engineer owns Rolled Throughput Yield (RTY) performance for the Displays product line and uses RTY and defect data to frame, prioritize, and lead continuous improvement initiatives. These efforts are aimed at eliminating systemic defect drivers, stabilizing manufacturing and test processes, and structurally removing cost from both product and process, rather than relying on inspection, rework, or short‑term containment.

This position requires practical experience in Circuit Card Assembly (CCA) design to diagnose manufacturing defects arising from marginal design decisions, component selection, layout sensitivities, or testability limitations. Operating in a complex, regulated avionics manufacturing environment, the role partners closely with Manufacturing, Test, and Operations, and works in tight collaboration with Quality, who owns first‑mile and last‑mile quality including supplier and customer‑facing issues. The Manufacturing Engineer leads defect resolution within the factory, ensures corrective actions are permanent and prevention‑based, and applies design‑informed manufacturing insight to strengthen process robustness and execution.

Rolled Throughput Yield Ownership & Analytics:

• Own Rolled Throughput Yield (RTY) for the Displays product line, including analysis by process step, failure mechanism, and product variant
• Identify leading indicators of RTY degradation (repeat defects, rework loops, test fallout) and act before yield loss escalates
• Develop RTY loss trees and defect pareto to focus improvement activity on the highest‑impact opportunities

Defect Resolution:

• Lead structured defect resolution for manufacturing, integration, calibration, and test‑induced failures
• Drive cross‑functional root cause analysis and corrective actions relating to factory failures in collaboration with Manufacturing, Manufacturing/Test/Design Engineering, Operations, and Quality
• Partner with Quality Engineering to provide deep manufacturing and CCA‑specific technical insight to Quality‑led investigations
• Collaborate with Manufacturing Engineering and Test Engineering to address CCA‑related defect drivers through improved process controls, screening strategies, test conditions, or work instructions
• Apply CCA‑level design knowledge (schematics, layouts, component behavior, and manufacturing interfaces) to identify defect root causes related to soldering, component sensitivity, layout robustness, thermal effects, and test access

Continuous Improvement & Cost Takeout

• Use RTY and defect data to frame continuous improvement projects that eliminate waste, rework, and non‑value‑added process steps

Basic Qualifications:

• Bachelor’s degree in Engineering (Manufacturing, Electrical/Computer, Mechanical, Systems, or related). Electrical/Computer Engineering preferred.
• 3+ years of experience in manufacturing, operations engineering, production engineering, or sustaining engineering
• Demonstrated experience improving yield (RTY/FPY) and resolving systemic defects in a complex manufacturing environment
• Hands‑on experience with Circuit Card Assembly (CCA) at the design‑manufacturing interface, such as Design for Manufacturing (DFM) support, electronics troubleshooting, sustaining engineering, or manufacturing support
• Ability to interpret schematics, layouts, and component behavior to assess impact on manufacturability, testability, and RTY
• Strong structured problem‑solving capability (i.e. A3, 5‑Why, Fishbone, PDCA)
• Experience partnering with Quality, Manufacturing, and Test in a regulated environment (Aerospace, Defense, Medical, Automotive, or similar)

Preferred Qualifications:

• Experience with avionics, displays, electronics, or electro‑mechanical assemblies
• Prior involvement with high‑reliability CCA manufacturing (IPC Class 3, AS9100 environments)
• Familiarity with common CCA defect mechanisms (solder joint reliability, thermal stress, component derating, layout‑induced sensitivity, test‑induced failures)
• Exposure to Lean Manufacturing, Continuous Improvement, or formal operating systems

Additional information

Equal Opportunity Statement Acron Aviation is proud to be an Affirmative Action and Equal Opportunity Employer. We are committed to treating all employees and applicants with respect and dignity and to maintaining a workplace free from unlawful discrimination. All applicants will be considered for employment regardless of race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding, or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, or any other legally protected characteristic.

Acron Aviation maintains a drug-free workplace and conducts pre-employment substance abuse testing and background checks, where allowed by law. Acron Aviation is an E-Verify employer.

• Bachelor’s degree in Engineering (Manufacturing, Electrical/Computer, Mechanical, Systems, or related). Electrical/Computer Engineering preferred.

• 3+ years of experience in manufacturing, operations engineering, production engineering, or sustaining engineering

• Demonstrated experience improving yield (RTY/FPY) and resolving systemic defects in a complex manufacturing environment

• Hands‑on experience with Circuit Card Assembly (CCA) at the design‑manufacturing interface, such as Design for Manufacturing (DFM) support, electronics troubleshooting, sustaining engineering, or manufacturing support

• Ability to interpret schematics, layouts, and component behavior to assess impact on manufacturability, testability, and RTY

• Strong structured problem‑solving capability (i.e. A3, 5‑Why, Fishbone, PDCA)

• Experience partnering with Quality, Manufacturing, and Test in a regulated environment (Aerospace, Defense, Medical, Automotive, or similar)

• Experience with avionics, displays, electronics, or electro‑mechanical assemblies

• Prior involvement with high‑reliability CCA manufacturing (IPC Class 3, AS9100 environments)

• Familiarity with common CCA defect mechanisms (solder joint reliability, thermal stress, component derating, layout‑induced sensitivity, test‑induced failures)

• Exposure to Lean Manufacturing, Continuous Improvement, or formal operating systems

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