Overview
About Us Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces. Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected. About the Role As a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions – from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, wor
Full job description
Full Job Description
About Us
Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces.
Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.
About the Role
As a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions – from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, working hand-in-hand with hardware, software, GNC and ML teams.
Responsibilities
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RF Electronic Packaging: Design mechanical packaging for RF and high-power electronics (a core requirement of the role).
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Thermal Management: Design thermal solutions for high-power, high-density electronics.
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Shielding & Cabling: Integrate EMI/RF shielding and manage cable routing and constraints.
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Mechanical Design: Own mechanical design from concept through prototyping and validation.
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Technical Coordination: Collaborate across HW, software, GNC and ML teams on integration and technical interfaces.
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System Reviews & Documentation: Contribute to design and architecture reviews and maintain documentation and traceability.
Candidate Requirements
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Experience in RF electronic packaging is a must.
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Previous RF experience (radar, radio or EW) is a strong plus, to keep the associated constraints in mind (shielding, thermal, cabling, etc.).
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Strong background in mechanical design, thermal management and packaging.
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Broad engineering culture with understanding of electrical and embedded systems.
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MSc in Mechanical Engineering; PhD is a plus.
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Rigorous, structured and mission-driven mindset with strong analytical skills.
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Excellent communication and documentation abilities.
We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.
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Verification notes
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