Principal Subsystem Design Engineer

Full Job Description

Provide technical leadership for Memory Subsystem development as a Design engineer, driving solutions from architecture and microarchitecture through silicon bring-up. Lead the design, integration, and verification of high-performance, complex SoC subsystems, with a focus on memory technologies, bandwidth, latency, utilization, power, and overall system efficiency. Collaborate closely with Architecture, RTL Design, DV, Physical Design (PD), Design-for-Test (DFT), Firmware, and Post-Silicon teams to resolve system-level issues and deliver robust silicon. Drive vertical and horizontal IP/component reuse across projects and platforms, ensuring scalable and efficient subsystem architectures. Provide technical leadership through mentorship, design reviews, code reviews, and cross-functional collaboration, helping to establish and maintain engineering best practices. Develop and optimize subsystem architectures involving PCIe, HBM, imaging and control subsystems, interconnect fabrics, AMBA AXI/CHI protocols, DMA engines, NoCs, and high-throughput data buffering and movement. Drive design implementation, including microarchitecture specification, RTL development and integration using Verilog/SystemVerilog, synthesis, timing constraints, floor-planning considerations, performance optimization, and design-quality closure including CDC, lint, and RDC. Debug complex design and system-level issues across simulation, emulation, and silicon, working across disciplines to identify root causes and implement effective solutions. Drive execution in an Agile development environment, including sprint planning, feature deployment, code reviews, issue resolution, and continuous improvement of design and verification processes. Champion high-quality engineering execution and contribute to delivering cutting-edge, custom IP and SoC solutions that meet demanding performance, power, efficiency, and schedule requirements. Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable. 9+ years of experience in RTL design with a proven track record of delivering high-performance IP, SS, or SoC designs such as PCIe, DDR, or HBM. Expertise in microarchitecture specification, RTL coding, and design verification collaboration. Experience in synthesis, timing constraints, power / performance / area (PPA) trade-offs and post-silicon debug. Experience with design quality and static checks, DFT implementation and hand off to physical design. Lead experience for an IP or SS related to CPUs, VPUs, GPUs, Direct Memory Access (DMA) engine, Tensor unit, or similar Experience with lead roles across cross-functional / cross-time-zone engineering teams Experience of working on Artificial Intelligence (AI) / Machine Learning (ML) SoCs Experience in Scripting language such as Python or Perl

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