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Senior PCB Layout Engineer

Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place!

Job Full source details
Espace Source published Sep 20, 2026 Verified 6 hours ago
✓ 100% verification score · Source: Espace (lever) · Always confirm final requirements on the original source.
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EmploymentFull-Time

Overview

Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place!

Full job description

Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place!

E-Space is bridging Earth and space to enable hyper-scaled deployments of Internet of Things (IoT) solutions and services. We are building a highly-advanced low Earth orbit (LEO) space system that will fundamentally change the design, economics, manufacturing and service delivery associated with traditional satellite and terrestrial IoT systems.

We’re intentional, we’re unapologetically curious and we’re 100% committed to innovate space-based communications and deliver actionable intelligence that will expand global economies, protect space and our planet and enhance our overall quality of life.

The Senior PCB Layout Engineer is responsible for leading the physical implementation of complex, high-performance printed circuit boards from concept through production. This role requires deep expertise in multi-layer, high-speed, RF, and mixed-signal PCB layout, strong ownership of stackup and via architecture decisions, and direct engagement with PCB fabrication and assembly partners to ensure manufacturability, reliability, and cost efficiency.

Technical Leadership

· Lead PCB layout architecture for complex multi-layer designs (10–20+ layers) including high-speed digital, RF, analog, and power circuitry

· Define and own stackups, impedance models, and via strategies (through, blind, buried, microvias, backdrilling)

· Serve as the DFM authority for layout decisions, balancing electrical performance, cost, yield, and reliability

Advanced PCB Design & Layout

· Perform and guide component placement optimizing signal integrity, power integrity , EMI/EMC, thermal, and mechanical performance

· Route high-speed serial interfaces, differential pairs, controlled-impedance nets, and sensitive RF/analog signals

· Design robust power distribution networks and grounding structures

· Apply advanced shielding and isolation techniques for EMI/EMC control

Fabrication & Assembly Interface

· Lead DFM/DFA reviews with PCB fabrication and assembly partners

· Resolve complex DFM issues related to:

o HDI structures and sequential lamination

o Via consolidation, backdrilling, and drill count reduction

o Stackup optimization for yield and cost

· Optimize designs for manufacturability, reliability, and volume production

Cross-Functional Collaboration

· Work closely with electrical, mechanical, test, and manufacturing engineers throughout the product lifecycle

· Support board bring-up, debug, ECOs, and production transitions

· Mentor and technically guide junior PCB layout engineers

Documentation & Process Ownership

· Create and review stackup drawings, fabrication notes, assembly notes, and manufacturing data packages (Gerber / ODB++)

· Establish, maintain, and enforce PCB layout standards and best practices

· Drive continuous improvement in layout quality, DFM compliance, and cost efficiency

10+ years of hands-on PCB layout experience delivering complex designs from concept to production

Expert-level proficiency in PCB layout tools such as Altium Designer, Cadence Allegro

Deep understanding of:

Controlled-impedance routing and signal integrity fundamentals

Power integrity, grounding, and EMI/EMC best practices

PCB materials, stackups, and fabrication processes

HDI PCB design, advanced via structures, and manufacturing constraints

Experience with:

High-speed interfaces (PCIe, Ethernet, DDR, JESD, SERDES)

RF and mixed-signal PCB layouts

Aerospace, data center, or high-reliability hardware designs

Bachelor’s degree in electrical engineering, Computer Engineering, or a related field (Master’s degree is a plus).

Familiarity with advanced PCB fabrication technologies such as mSAP (Modified Semi-Additive Process) and SLP (Substrate-Like PCB), including fine-line routing, small via structures, and associated DFM constraints

Working knowledge of Signal and power integrity simulation tools and DFM analysis workflows

This is a fast-paced, high-impact environment - flexibility to occasionally work extended hours or weekends during critical periods is expected.

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