Technical Program Manager (f/m/d)

About us We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects About our technology The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution The Role Black Semiconductor GmbH is looking for a Technical Program Manager for a new product launch who will be responsible for overseeing the development and delivery of Application Specific Integrated Circuit (ASIC) programs combining electronics and photonics in advanced chiplet packages. The role involves leading and supporting cross-functional engineering teams, partnering closely with product management on scope and priorities, and coordinating external third-party IP and qualification providers to ensure the program meets time, technical, cost and quality targets. As the Technical Program Manager, you will oversee the complete silicon and chiplet program cycle, from initial concept through implementation, validation, qualification, and final release to product — combining hands-on program management with enough technical fluency to catch integration and schedule risk before it becomes a crisis. You will drive program schedules, resolve technical and cross-functional issues, and lead the Program Core Team to align decisions, manage dependencies, and execute against milestones. This is a mid-level role: you'll take ownership of a defined program end-to-end rather than coordinating meetings for others, but you won't be expected to build program management infrastructure from the ground up on day one. To join our team, you should be excited to Collaborate with cross-functional engineering teams and product management to set milestones, create integration plans, and address potential risks with mitigation strategies for next-generation chiplet products. Develop schedules, identify critical paths and bottlenecks, and maintain execution throughout the duration of programs. Coordinate the timely conception, development, and delivery of Application-Specific electronic and photonic integrated circuit programs, including multi-die/chiplet integration and known-good-die qualification. Own the relationship with external third-party IP and qualification providers — tracking their deliverables against program milestones, running regular review cadences, and escalating risks before they hit the critical path. Partner with product management to translate product requirements and priorities into an executable technical program plan, and keep both sides aligned as scope or schedule trade-offs come up. Build and maintain strong working relationships and communicate effectively across multidisciplinary teams and leadership. Manage chip delivery for development builds and ensure qualification to meet mass production schedules. Serve as the primary point of accountability for program execution. Ensure program documents are complete, up-to-date, and accessible. Manage external suppliers more broadly. This includes allocating resources, establishing review processes, and coordinating with supply chain and operations. Your Qualification Bachelor's degree in Engineering, Computer Science, or a related technical field, or equivalent practical experience. 5+ years of experience managing silicon, ASIC, IP, or photonics development programs, with proven ownership of semiconductor product lifecycles from concept through implementation, validation, qualification, and release. Experience managing complex semiconductor programs involving external IP vendors, qualification providers, or test houses, ideally within chiplet, multi-die, or advanced packaging environments. Strong ability to translate product requirements into executable technical plans, manage priorities and trade-offs, and drive execution through defined milestones, metrics, schedules, risks, and dependencies. Experience leading cross-functional engineering teams and collaborating effectively with Product Management, suppliers, manufacturing partners, and external stakeholders. Hands-on experience with ASIC/silicon development flows, chiplet/multi-die integration, qualification processes, PLM systems, risk management, change control, supplier coordination, and program tracking tools. Strong communication, problem-solving, and stakeholder management skills, with the ability to work independently and within multidisciplinary teams. Results-oriented, proactive, and self-motivated, with strong analytical, creative, and critical thinking skills. Fluency in English is required; German language skills and Program Management certification are considered a plus. Knowledge of semiconductor industry trends and disruptive technologies, including chiplet architectures and advanced packaging ecosystems, is considered a plus. Our work culture People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are hum

Requirements: qualification providers to ensure the program meets time, technical, cost and quality targets. As the Technical Program Manager, you will oversee the complete silicon and chiplet program cycle, from initial concept through implementation, validation, qualification, and final release to product — combining hands-on program management with enough technical fluency to catch integration and schedule risk before it becomes a crisis. You will drive program schedules, resolve technical and cross-functional issues, and lead the Program Core Team to align decisions, manage dependencies, and execute against milestones. This is a mid-level role: you'll take ownership of a defined program end-to-end rather than coordinating meetings for others, but you won't be expected to build program management infrastructure from the ground up on day one. To join our team, you should be excited to Collaborate with cross-functional engineering teams and product management to set milestones, create integration plans, and address potential risks with mitigation strategies for next-generation chiplet products. Develop schedules, identify critical paths and bottlenecks, and maintain execution throughout the duration of programs. Coordinate the timely conception, development, and delivery of Application-Specific electronic and photonic integrated circuit programs, including multi-die/chiplet integration and known-good-die qualification. Own the relationship with external third-party IP and qualification providers — tracking their deliverables against program milestones, running regular review cadences, and escalating risks before they hit the critical path. Partner with product management to translate product requirements and priorities into an executable technical program plan, and keep both sides aligned as scope or schedule trade-offs come up. Build and maintain strong working relationships and communicate effectively across multidisciplinary teams and leadership. Manage chip delivery for development builds and ensure qualification to meet mass production schedules. Serve as the primary point of accountability for program execution. Ensure program documents are complete, up-to-date, and accessible. Manage external suppliers more broadly. This includes allocating resources, establishing review processes, and coordinating with supply chain and operations. Your Qualification Bachelor's degree in Engineering, Computer Science, or a related technical field, or equivalent practical experience. 5+ years of experience managing silicon, ASIC, IP, or photonics development programs, with proven ownership of semiconductor product lifecycles from concept through implementation, validation, qualification, and release. Experience managing complex semiconductor programs involving external IP vendors, qualification providers, or test houses, ideally within chiplet, multi-die, or advanced packaging environments. Strong ability to translate product requirements into executable technical plans

qualification providers to ensure the program meets time, technical, cost and quality targets. As the Technical Program Manager, you will oversee the complete silicon and chiplet program cycle, from initial concept through implementation, validation, qualification, and final release to product — combining hands-on program management with enough technical fluency to catch integration and schedule risk before it becomes a crisis. You will drive program schedules, resolve technical and cross-functional issues, and lead the Program Core Team to align decisions, manage dependencies, and execute against milestones. This is a mid-level role: you'll take ownership of a defined program end-to-end rather than coordinating meetings for others, but you won't be expected to build program management infrastructure from the ground up on day one. To join our team, you should be excited to Collaborate with cross-functional engineering teams and product management to set milestones, create integration plans, and address potential risks with mitigation strategies for next-generation chiplet products. Develop schedules, identify critical paths and bottlenecks, and maintain execution throughout the duration of programs. Coordinate the timely conception, development, and delivery of Application-Specific electronic and photonic integrated circuit programs, including multi-die/chiplet integration and known-good-die qualification. Own the relationship with external third-party IP and qualification providers — tracking their deliverables against program milestones, running regular review cadences, and escalating risks before they hit the critical path. Partner with product management to translate product requirements and priorities into an executable technical program plan, and keep both sides aligned as scope or schedule trade-offs come up. Build and maintain strong working relationships and communicate effectively across multidisciplinary teams and leadership. Manage chip delivery for deve