IC Package Layout Engineer

About The Role

Mobileye develops purpose-built hardware and AI technologies that power advanced driver-assistance and autonomous-driving solutions. Our EyeQ™ SoCs and imaging radar technologies are designed to deliver scalable, automotive-grade performance and help enable safer mobility worldwide. Join our advanced packaging team and take ownership of package-substrate layout for cutting-edge digital and RF products. You will collaborate with silicon, package, SI/PI, PCB, manufacturing, and OSAT teams to deliver high-quality, manufacturable package layouts that meet demanding automotive requirements

What Will Your Job Look Like:

• Own IC package-substrate layout from feasibility through manufacturing release.

• Perform die placement, bump fan-out, ball-map planning, package-size estimation, and layer planning.

• Set up stack-ups, padstacks, design rules, and layout constraints.

• Implement high-density bump-to-ball routing for signal, power, and ground nets.

• Route high-speed and RF interfaces according to defined SI/PI constraints.

• Perform DRC, connectivity, LVS/netlist, and DFM checks.

• Generate artwork, fabrication drawings, reports, and release documentation.

• Resolve layout-related queries from substrate manufacturers and OSATs.

All You Need Is:

• B.Sc. in Electrical Engineering or a related field, or equivalent practical experience.

• 5+ years of hands-on IC package-substrate layout experience.

• Strong proficiency with Cadence Allegro Package Designer.

• Experience with flip-chip BGA, bump fan-out, ball-map optimization, and multilayer substrate routing.

• Experience working from schematics, netlists, design rules, and constraint documents.

• Good understanding of high-speed layout principles, including differential pairs, length matching, spacing, and return paths.

• Good understanding of power-delivery and power-integrity layout principles, including power and ground plane design, current-carrying requirements, and via-array implementation.

• Experience with DRC, connectivity verification, DFM, and manufacturing-data release.

• Strong attention to detail and the ability to independently own designs through release.

Nice To Have:

• Experience with RF, SiP, multi-die, interposer, or 2.5D package layouts.

• Experience with DDR, PCIe, SerDes, MIPI, or UFS interfaces.

• Experience with Siemens Xpedition Package Designer or CAM350.

• Experience working directly with substrate manufacturers and OSATs.

• Experience with scripting for package-layout automation.

Additional information

Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!