Package Reliability Engineer (f/m/d)

About us We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects About our technology The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution The Role We are seeking a Package Reliability Engineer to join our team. In this role, you will own the reliability of our packaged products, from defining mission profiles and reliability targets to identifying package-level failure mechanisms, developing qualification strategies, and making evidence-based release recommendations. Reporting to the Quality & Reliability Program Lead, you will work closely with the Package Architecture, Device Reliability, Product Engineering, and OSAT/laboratory partners to translate product use cases into mission profiles and FIT/MTBF targets. You will assess reliability risks, define and execute package-level reliability test plans, lead failure analysis activities, and ensure findings are driven to resolution. Your core focus will be to transform product requirements into robust reliability strategies, validate package concepts through targeted stress testing, and provide data-driven recommendations that enable confident product release. To join our team, you should be excited to: Own mission profiles and reliability targets by defining product operating conditions (temperature, voltage, humidity, thermal cycling, and lifetime requirements) and allocating FIT, MTBF, and lifetime targets across package, interconnect, and device-level contributors. Assess package reliability risks by evaluating failure mechanisms across substrates, die attach, interconnects, solder joints, board attach, and optical/fiber interfaces, including delamination, warpage, fatigue, electromigration, and optical or electrical drift. Define and execute package reliability qualification plans covering thermal, mechanical, environmental, and board-level stress testing in accordance with JEDEC, AEC-Q100/Q006, IPC, IEC, and customer-specific requirements. Lead the technical interface with OSATs, substrate suppliers, and labs , defining reliability requirements, reviewing data, and challenging results when the supporting evidence is insufficient or unrepresentative. Drive root-cause investigations and failure analysis , leveraging techniques such as X-ray, C-SAM, cross-sectioning, SEM/EDX, and related methods, and translate findings into CAPA/8D actions, design improvements, and requalification decisions. Develop risk-based qualification strategies for novel packaging technologies, such as UBC and optical interconnects, where industry standards are incomplete or do not yet exist. Provide data-driven release recommendations by assessing whether products are ready for customer sampling, qualification milestones, or production release, while clearly communicating any remaining reliability risks. Your Qualifications Educational background with a Master's degree (or equivalent experience) in Electrical Engineering, Microelectronics, Materials Science, Reliability Engineering, or a related field. Package reliability expertise with 3–5+ years of experience evaluating semiconductor package construction (substrates, die attach, interconnects, and solder joints) and understanding the failure mechanisms associated with these technologies. Understanding of high-speed I/O and RF reliability , including how reliability degradation impacts high-speed serial, RF, and optical interfaces (e.g., signal integrity, insertion loss, jitter, and eye closure over product lifetime). This expertise goes beyond conventional digital logic reliability and is a core requirement for this role. Experience with photonics reliability is highly desirable. Solid foundation in reliability engineering , including FIT and MTBF calculations, mission profile development, acceleration models, and translating product use cases into measurable reliability requirements and targets. Experience with industry qualification standards , including JEDEC, AEC-Q100/Q006, IPC, and IEC, as well as the judgment to apply knowledge-based qualification approaches when existing standards are not sufficient. Failure analysis expertise , with the ability to interpret results from techniques such as X-ray, C-SAM, cross-sectioning, and SEM/EDX, and translate findings into risk-based recommendations. Experience collaborating with OSATs, substrate suppliers, and external laboratories , including defining technical reliability requirements, reviewing qualification data, and driving technical discussions to ensure robust evidence for product qualification. Excellent cross-functional communication skills , with the ability to clearly communicate reliability risks, trade-offs, and evidence gaps to architects, engineers, suppliers, and leadership. Thrives in a startup environment , demonstrating initiative, ownership, adaptability, and the ability to make progress in a fast-paced, resource-conscious setting. Our work culture People Over Processes.

Requirements: qualification strategies, and making evidence-based release recommendations. Reporting to the Quality & Reliability Program Lead, you will work closely with the Package Architecture, Device Reliability, Product Engineering, and OSAT/laboratory partners to translate product use cases into mission profiles and FIT/MTBF targets. You will assess reliability risks, define and execute package-level reliability test plans, lead failure analysis activities, and ensure findings are driven to resolution. Your core focus will be to transform product requirements into robust reliability strategies, validate package concepts through targeted stress testing, and provide data-driven recommendations that enable confident product release. To join our team, you should be excited to: Own mission profiles and reliability targets by defining product operating conditions (temperature, voltage, humidity, thermal cycling, and lifetime requirements) and allocating FIT, MTBF, and lifetime targets across package, interconnect, and device-level contributors. Assess package reliability risks by evaluating failure mechanisms across substrates, die attach, interconnects, solder joints, board attach, and optical/fiber interfaces, including delamination, warpage, fatigue, electromigration, and optical or electrical drift. Define and execute package reliability qualification plans covering thermal, mechanical, environmental, and board-level stress testing in accordance with JEDEC, AEC-Q100/Q006, IPC, IEC, and customer-specific requirements. Lead the technical interface with OSATs, substrate suppliers, and labs , defining reliability requirements, reviewing data, and challenging results when the supporting evidence is insufficient or unrepresentative. Drive root-cause investigations and failure analysis , leveraging techniques such as X-ray, C-SAM, cross-sectioning, SEM/EDX, and related methods, and translate findings into CAPA/8D actions, design improvements, and requalification decisions. Develop risk-based qualification strategies for novel packaging technologies, such as UBC and optical interconnects, where industry standards are incomplete or do not yet exist. Provide data-driven release recommendations by assessing whether products are ready for customer sampling, qualification milestones, or production release, while clearly communicating any remaining reliability risks. Your Qualifications Educational background with a Master's degree (or equivalent experience) in Electrical Engineering, Microelectronics, Materials Science, Reliability Engineering, or a related field. Package reliability expertise with 3–5+ years of experience evaluating semiconductor package construction (substrates, die attach, interconnects, and solder joints) and understanding the failure mechanisms associated with these technologies. Understanding of high-speed I/O and RF reliability , including how reliability degradation impacts high-speed serial, RF, and optical interfaces (e.g., signal integrity,

qualification strategies, and making evidence-based release recommendations. Reporting to the Quality & Reliability Program Lead, you will work closely with the Package Architecture, Device Reliability, Product Engineering, and OSAT/laboratory partners to translate product use cases into mission profiles and FIT/MTBF targets. You will assess reliability risks, define and execute package-level reliability test plans, lead failure analysis activities, and ensure findings are driven to resolution. Your core focus will be to transform product requirements into robust reliability strategies, validate package concepts through targeted stress testing, and provide data-driven recommendations that enable confident product release. To join our team, you should be excited to: Own mission profiles and reliability targets by defining product operating conditions (temperature, voltage, humidity, thermal cycling, and lifetime requirements) and allocating FIT, MTBF, and lifetime targets across package, interconnect, and device-level contributors. Assess package reliability risks by evaluating failure mechanisms across substrates, die attach, interconnects, solder joints, board attach, and optical/fiber interfaces, including delamination, warpage, fatigue, electromigration, and optical or electrical drift. Define and execute package reliability qualification plans covering thermal, mechanical, environmental, and board-level stress testing in accordance with JEDEC, AEC-Q100/Q006, IPC, IEC, and customer-specific requirements. Lead the technical interface with OSATs, substrate suppliers, and labs , defining reliability requirements, reviewing data, and challenging results when the supporting evidence is insufficient or unrepresentative. Drive root-cause investigations and failure analysis , leveraging techniques such as X-ray, C-SAM, cross-sectioning, SEM/EDX, and related methods, and translate findings into CAPA/8D actions, design improvements, and requalification decisions. Develop r