Overview
Responsibilities will include adapting industry standard packaging processes and materials to the unique requirements of quantum devices. End-to-end quantum device package assembly and build execution. Manufacturing equipment operation, training, and process optimization. Packaging configuration documentation and records maintenance. Analysis and problem-solving involving assembly process failures. Reliability testing, adhesive characterization, and process development. Develop and maintain robust assembly processes for quantum devices. Support general laboratory organization and upkeep Work in teams or independently as required. Embody our Culture and Values Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering
Full job description
Full Job Description
Responsibilities will include adapting industry standard packaging processes and materials to the unique requirements of quantum devices. End-to-end quantum device package assembly and build execution. Manufacturing equipment operation, training, and process optimization. Packaging configuration documentation and records maintenance. Analysis and problem-solving involving assembly process failures. Reliability testing, adhesive characterization, and process development. Develop and maintain robust assembly processes for quantum devices. Support general laboratory organization and upkeep Work in teams or independently as required. Embody our Culture and Values Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation). Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience OR equivalent experience Hands-on experience with industry standard packaging and assembly processes (wire bonding, die bonding, adhesive dispense) Hands-on experience with industry standard packaging and assembly materials (PCBs, adhesives, solder) Ability to work in a team and effectively communicate to meet deadlines and deliver results. 2+ years of hands-on experience with packaging of complex (optomechanical, MEMS, microwave) devices
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