Overview
Temasek Polytechnic's Engineering Scholarship offers eligible Year 1 full-time School of Engineering students up to S$9,000 over three academic years, subject to renewal conditions.
Complete scholarship details
Temasek Polytechnic is accepting applications for its Engineering Scholarship for AY2026/2027. The official scholarship page states that the award is open to Year 1 full-time School of Engineering students of all nationalities. It provides up to S$3,000 per academic year, up to S$9,000 in total over three years, subject to annual renewal, and is bond-free. The programme also includes leadership development and an overseas opportunity. Applications opened on 5 August 2026 and close at 12 noon on 21 September 2026.
Eligibility requirements
Applicants must be Year 1 full-time students in Temasek Polytechnic's School of Engineering and meet the academic, conduct, CCA and leadership criteria stated in the official page. The page specifies top 5% standing or a cumulative GPA of at least 3.50 after Year 1 Semester 1, good CCA participation and conduct, leadership qualities, and restrictions on holding another scholarship, subject to the listed government-bursary exception for Singapore citizens. Employer-sponsored students are not eligible.
Tips for this scholarship
Practical Job and Scholarship guidance. These tips do not replace official rules or create new eligibility requirements.
- Check eligibility, funding coverage, study/project level and every required document before investing time in the application.
- Prepare transcripts, references, language tests, proposal/motivation statement and proof documents early.
- Separate the scholarship deadline from any university/program admission deadline; they may be different.
- Treat “fully funded” as a source fact only when the official provider explicitly confirms the covered costs.
Verification notes
Verified against the official Temasek Polytechnic Engineering Scholarship page. It confirms eligibility for Year 1 full-time School of Engineering students of all nationalities, academic/CCA/conduct/leadership criteria, a bond-free award of up to S$3,000 per academic year and S$9,000 total over three years subject to renewal, and a closing time of 12 noon on 21 September 2026.
Job and Scholarship is the discovery and verification layer. Confirm eligibility, dates, salary/funding and application instructions on the original source before submitting anything.
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