Microsoft Opportunities

Full Job Description

Soc level definition of High-speed IO PHYs like Ethernet, HBM4/4E/5, D2D Participation and quality supervision of Signal and Power Integrity Define and quality control of end-to-end Power delivery solutions Soc level REFCLK and digital clocking definition and clock methodology and quality simulations Participating in SoC technology definitions partnering with package and System design teams Participate in SoC level Memory definition and partner with custom memory development team in defining new memory related IPs Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable. 15+ years of experience in Soc level Circuit architecture and design with MSEE or 12+ years of experience in the same with PhD in Electrical Engineering Experience in PLL and Clocking solutions of AI SoC's Experience in High Speed IO PHY design and Signal Integrity Familiarity with Package/substrate design issues on signals and Power delivery Familiarity with PCB design especially related to power delivery of AI SoC's