Opportunities from Microsoft Careers

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Advanced Heterostructure Growth: Define, implement, and refine thin film deposition protocols for complex superconductor-semiconductor heterostructures and semiconductor-dielectric interfaces; Achieve precise control over interfaces, composition, strain, band offsets, and defect density. Materials-Device Feedback & Experimentation: Design and execute principled, data driven experiments that couple thin film deposition conditions to structure, materials properties, and device outcomes; ensure materials advances translate into measurable qubit improvements; provide technical judgment on materials tradeoffs that influence fabrication flows and process integration decisions. Tooling & Diagnostics Leadership: Design, build, upgrade, and maintain thin film deposition systems and in‑situ diagnostics (e.g., RHEED, spectroscopy); develop or integrate new diagnostics and tool capabilities to enable next‑generation materials performance; Cross Functional Technical Leadership: Collaborate closely with nanofabrication, characterization, theory, and device teams to enable coherent, end-to-end process development; Communicate complex materials insights clearly across disciplines and help set technical direction where materials are the limiting factor. AI Accelerated Materials Development: Operate effectively in an AI‑first R&D environment, using modern AI tools to accelerate discovery and optimization; Design or leverage AI agents/copilots to assist with experiment planning, log analysis, protocol templating, data interpretation, and knowledge retrieval. Other Bachelor's Degree in Materials Science, Electrical Engineering, Chemistry, Physics, or related field AND 8+ years' experience in industry or in a research and development environment OR Master's Degree in Materials Science, Electrical Engineering, Chemistry, Physics, or related field AND 6+ years' experience in industry or in a research and development environment OR Doctorate in Materials Science, Electrical Engineering, Chemistry, Physics, or related field AND 3+ years' experience in industry or in a research and development environment Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation). Ability to design and build AI agents/copilots that assist with experiment setup, log triage, measurement report generation, protocol templating, and knowledge retrieval (e.g. instrument manuals, design docs) Bachelor's Degree in Materials Science, Electrical Engineering, Chemistry, Physics, or related field AND 12+ years' experience in industry or in a research and development environment OR Master's Degree in Materials Science, Electrical Engineering, Chemistry, Physics, or related field AND 8+ years' experience in industry or in a research and development environment OR Doctorate in Materials Science, Electrical Engineering, Chemistry, Physics, or related field AND 5+ years' experience in industry or in a research and development environment OR equivalent experience. 12+ years of experience with thin film deposition techniques including at least one of the following: molecular beam epitaxy (MBE), atomic layer deposition (ALD), or reactive sputtering 12+ years of experience with thin film structural characterization techniques such as ellipsometry, x-ray diffraction, atomic force microscopy, x-ray photoelectron spectroscopy, or transmission electron microscopy Experience with engineering the electronic properties of metal-semiconductor interfaces Experience with superconductor-semiconductor hybrid materials or III-V/high-k interfaces Experience with optimizing the radio frequency (RF) performance of materials Demonstrated ability to work effectively in interdisciplinary teams with a focus on materials and process optimization